Semiconductor package device and method of manufacturing the same

ABSTRACT

A semiconductor package device includes a substrate, a passive component, an active component and a package body. The passive component is disposed on the substrate. The active component is disposed on the substrate. The package body is disposed on the substrate. The package body includes a first portion covering the active component and the passive component, and a second portion covering the passive component. A top surface of the second portion of the package body is higher than a top surface of the first portion of the package body.

BACKGROUND 1. Technical Field

The present disclosure relates to a semiconductor package device and amethod of manufacturing the same, and more particularly, to asemiconductor package device including a shielding layer and a method ofmanufacturing the same.

2. Description of the Related Art

Semiconductor devices have become progressively more complex, driven atleast in part by the demand for enhanced processing speeds and smallersizes. Enhanced processing speeds tend to involve higher clock speeds,which can involve more frequent transitions between signal levels,which, in turn, can lead to a higher level of electromagnetic emissionsat higher frequencies or shorter wavelengths. Electromagnetic emissionscan radiate from a source semiconductor device, and can be incident uponneighboring semiconductor devices. If the level of electromagneticemissions at a neighboring semiconductor device is sufficiently high,these emissions can adversely affect the operation of the neighboringsemiconductor device. This phenomenon is sometimes referred to aselectromagnetic interference (EMI). Smaller sized semiconductor devicescan exacerbate EMI by providing a higher density of semiconductordevices within an overall electronic system, and, thus, a higher levelof undesired electromagnetic emissions at neighboring semiconductordevices.

One way to reduce EMI is to shield a set of semiconductor devices withina semiconductor package device. In particular, shielding can beaccomplished by including an electrically conductive casing or housingthat is electrically grounded and is secured to an exterior of thepackage. When electromagnetic emissions from an interior of the packagestrike an inner surface of the casing, at least a portion of theseemissions can be electrically shorted, thereby reducing the level ofemissions that can pass through the casing and adversely affectneighboring semiconductor devices. Similarly, when electromagneticemissions from a neighboring semiconductor device strike an outersurface of the casing, a similar electrical shorting can occur to reduceEMI of semiconductor devices within the package.

SUMMARY

In accordance with some embodiments of the present disclosure, asemiconductor package device includes a substrate, a passive component,an active component and a package body. The passive component isdisposed on the substrate. The active component is disposed on thesubstrate. The package body is disposed on the substrate. The packagebody includes a first portion covering the active component and thepassive component, and a second portion covering the passive component.A top surface of the second portion of the package body is higher than atop surface of the first portion of the package body.

In accordance with some embodiments of the present disclosure, asemiconductor package device includes a substrate, a first electroniccomponent, a second electronic component, a first package body and asecond package body. The first electronic component is disposed on thesubstrate. The second electronic component is disposed on the substrate.The first package body is disposed on the substrate to cover the secondelectronic component and to expose the first electronic component. Thesecond package body is disposed on the first package body and covers thesecond electronic component.

In accordance with some embodiments of the present disclosure, a methodof manufacturing a semiconductor package device includes: providing asubstrate; disposing a first electronic component on the substrate;disposing a second electronic component on the substrate; forming afirst package body on the substrate to cover the second electroniccomponent and at least a portion of the first electronic component;forming a second package body on the first package body and above thesecond electronic component; and forming a conductive layer to cover thefirst package body and the second package body. A top surface of thesecond package body is higher than a top surface of the first packagebody.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates a cross-sectional view of a semiconductor packagedevice in accordance with some embodiments of the present disclosure.

FIG. 2 illustrates a cross-sectional view of a semiconductor packagedevice in accordance with some embodiments of the present disclosure.

FIG. 3A, FIG. 3B, FIG. 3C and FIG. 3D illustrate a manufacturing methodin accordance with some embodiments of the present disclosure.

Common reference numerals are used throughout the drawings and thedetailed description to indicate the same or similar components. Thepresent disclosure will be more apparent from the following detaileddescription taken in conjunction with the accompanying drawings.

DETAILED DESCRIPTION

FIG. 1 illustrates a cross-sectional view of a semiconductor packagedevice 1 in accordance with some embodiments of the present disclosure.The semiconductor package device 1 includes a substrate 10, passivecomponents 11 a, 11 b, an active component 12, package bodies 13, 14 anda shielding layer 15. In some embodiments, the package body 13 isreferred to as a first package body 13 and the package body 14 isreferred to as a second package body 14. In some embodiments, a packagebody includes a first portion 13 of the package body and a secondportion 14 of the package body.

The substrate 10 may be, for example, a printed circuit board, such as apaper-based copper foil laminate, a composite copper foil laminate, or apolymer-impregnated glass-fiber-based copper foil laminate. Thesubstrate 10 may include an interconnection structure, such as aredistribution layer (RDL) or a grounding element. In some embodiments,the grounding element is a via exposed from a lateral surface 102 of thesubstrate 10. In some embodiments, the grounding element is a metallayer exposed from the lateral surface 102 of the substrate 10. In someembodiments, the grounding element is a metal trace exposed from thelateral surface 102 of the substrate 10.

The passive components 11 a, 11 b are disposed on a top surface 101 ofthe substrate 10. The passive component 11 a, 11 b may be an electroniccomponent, such as a capacitor, a resistor or an inductor. Each passivecomponent 11 a, 11 b may be electrically connected to one or more ofanother passive component 11 a, 11 b and to the substrate 10 (e.g., tothe RDL), and electrical connection may be attained by way of SurfaceMount Technology (SMT).

The active component 12 is disposed on the top surface 101 of thesubstrate 10. The active component 12 may be an electronic component,such as an integrated circuit (IC) chip or a die. The active component12 may be electrically connected to one or more of the passivecomponents 11 a, 11 b and to the substrate 10 (e.g., to the RDL), andelectrical connection may be attained by way of flip-chip or wire-bondtechniques. In some embodiments, a height of the active component 12measured from the top surface 101 of the substrate is greater than thatof the passive components 11 a, 11 b. In some embodiments, the activecomponent 12 is referred to as a first electronic component and thepassive component 11 a and/or 11 b is referred to as a second electroniccomponent.

The package body 13 is disposed on the top surface 101 of the substrate10 and encapsulates a part of the top surface 101 of the substrate 10,the passive components 11 a, 11 b and a part of the active component 12.A backside surface 121 (e.g., a top surface) of the active component 12is exposed from the package body 13. In other words, the backsidesurface 121 of the active component 12 is aligned with a top surface 131of the package body 13; for example, the backside surface 121 of theactive component 12 is substantially coplanar with the top surface 131of the package body 13. In some embodiments, the package body 13 coversthe respective backside surfaces 111 a, 111 b (e.g., top surfaces) ofthe passive components 11 a, 11 b. A lateral surface 132 of the packagebody 13 is aligned with the lateral surface 102 of the substrate 10; forexample, the lateral surface 132 of the package body 13 is substantiallycoplanar with the lateral surface 102 of the substrate 10. In someembodiments, the package body 13 includes an epoxy resin having fillersdispersed therein.

The package body 14 is disposed on a portion of the top surface 131 ofthe package body 13 and over the passive components 11 a, 11 b. Thepackage body 14 is not disposed over the active component 12. In someembodiments, a distance from a top surface 141 of the package body 14 tothe respective backside surfaces 111 a, 111 b (e.g., top surfaces) ofthe passive components 11 a, 11 b is in a range from about 50micrometers (μm) to about 100 μm. A thickness of the package body 14(e.g., a distance from the top surface 141 of the package body 14 to thetop surface 131 of the package body 13) is determined according to athickness difference between the active component 12 and the passivecomponents 11 a, 11 b. In some embodiments, an area of the package body14 is greater than an area of each of the passive components 11 a, 11 b.In some embodiments, the package body 14 comprises, or is formed from, aphotosensitive material, such as a photopolymer resin. In someembodiments, the package body 14 and the package body 13 comprise a samematerial. Alternatively, the package body 14 and the package body 13 maycomprise different materials. In some embodiments, the top surface 141of the package body 14 is higher than the top surface 131 of the packagebody 13. For example, a first distance may be between the top surface141 of the package body 14 and the top surface 101 of the substrate 10,and a second distance may be between the top surface 131 of the packagebody 13 and the top surface 101 of the substrate 10, and the firstdistance may be greater than the second distance.

The shielding layer 15 is disposed on the backside surface 121 of theactive component 12 and on external surfaces of the package body 13 andthe package body 14 to cover the package body 13, the package body 14,the active component 12 and the lateral surfaces 102 of the substrate10. The shielding layer 15 is electrically connected to the groundingelement of the substrate 10. In some embodiments, the shielding layer 15is a conformal shield. In some embodiments, a thickness of the shieldinglayer 15 is substantially uniform. A bottom of the shielding layer 15 isaligned with a bottom surface 103 of the substrate 10; for example, thebottom of the shielding layer 15 is substantially coplanar with thebottom surface 103 of the substrate 10. In some embodiments, theshielding layer 15 is a conductive thin film, and may include, forexample, aluminum (Al), copper (Cu), chromium (Cr), tin (Sn), gold (Au),silver (Ag), nickel (Ni) or stainless steel, or a mixture, an alloy, orother combination thereof. The shielding layer 15 may include a singleconductive layer or multiple conductive layers. In some embodiments, theshielding layer 15 includes multiple conductive layers, and the multipleconductive layers may include a same material, or ones of the multipleconductive layers may include different materials, or each of themultiple conductive layers may include different materials from othersof the multiple conductive layers. In some embodiments, each conductivelayer of the shielding layer 15 has a thickness of up to about 200 μm,such as up to about 150 μm, up to about 100 μm, up to about 50 μm, up toabout 10 μm, up to about 5 μm, up to about 1 μm, or up to about 500nanometers (nm). In some embodiments, each conductive layer of theshielding layer 15 has a thickness of down to about 100 nm or less, downto about 50 nm or less, or down to about 10 nm or less. In someembodiments, the shielding layer 15 includes multiple conductive layers,and the different conductive layers may have different thicknesses.Since the shielding layer 15 is conformal to the package body 14 and thepackage body 13, the shielding layer 15 includes a portion disposed onthe package body 14 and another portion disposed on the package body 13,and a top surface of the former portion of the shielding layer 15 ishigher than a top surface of the latter portion of the shielding layer15.

In some other semiconductor package devices, a distance from a topsurface of a package body to electronic components (e.g., moldclearance) may be insufficient, and thus a shielding layer in thesemiconductor package device may increase unwanted parasiticcapacitance, which may in turn deteriorate the reliability and functionof the semiconductor package device. In accordance with some embodimentsof the present disclosure, for example as shown in FIG. 1, the packagebody 14 is disposed over the passive components 11 a, 11 b to increasethe mold clearance, so as to reduce the parasitic capacitance effect. Byreducing the parasitic capacitance effect, the accuracy of the passivecomponents 11 a, 11 b may increase and then insertion loss and returnloss of a filter formed by the passive components 11 a, 11 b may be wellcontrolled.

FIG. 2 illustrates a cross-sectional view of a semiconductor packagedevice 2 in accordance with some embodiments of the present disclosure.The semiconductor package device 2 includes a substrate 20, passivecomponents 21 a, 21 b, an active component 22, a package body 23, apackage body 24 and a shielding layer 25. In some embodiments, thepackage body 23 is referred to as a first package body 23 and thepackage body 24 is referred to as a second package body 24. In someembodiments, a package body includes a first portion 23 of the packagebody and a second portion 24 of the package body.

The substrate 20 may be, for example, a printed circuit board, such as apaper-based copper foil laminate, a composite copper foil laminate, or apolymer-impregnated glass-fiber-based copper foil laminate. Thesubstrate 20 may include an interconnection structure, such as an RDL ora grounding element. In some embodiments, the grounding element is a viaexposed from a lateral surface 202 of the substrate 20. In someembodiments, the grounding element is a metal layer exposed from thelateral surface 202 of the substrate 20. In some embodiments, thegrounding element is a metal trace exposed from the lateral surface 202of the substrate 20.

The passive components 21 a, 21 b are disposed on a top surface 201 ofthe substrate 20. The passive component 21 a, 21 b may be an electroniccomponent, such as a capacitor, a resistor or an inductor. Each passivecomponent 21 a, 21 b may be electrically connected to one or more ofanother passive component 21 a, 21 b and to the substrate 20 (e.g., tothe RDL), and electrical connection may be attained by way of SMT.

The active component 22 is disposed on the top surface 201 of thesubstrate 20. The active component 22 may be an electronic component,such as an IC chip or a die. The active component 22 may be electricallyconnected to one or more of the passive components 21 a, 21 b and to thesubstrate 20 (e.g., to the RDL), and electrical connection may beattained by way of flip-chip or wire-bond techniques. In someembodiments, a height of the active component 22 measured from the topsurface 201 of the substrate 20 is less than that of at least one of thepassive components 21 a, 21 b. In some embodiments, the active component22 is referred to as a first electronic component and the passivecomponent 21 a and/or 21 b is referred to as a second electroniccomponent.

The package body 23 is disposed on the top surface 201 of the substrate20 and encapsulates a part of the top surface 201 of the substrate 20, apart of the passive components 21 a, 21 b and the active component 22.In some embodiments, both respective backside surfaces 211 a, 211 b(e.g., top surfaces) of the passive components 21 a, 21 b are exposedfrom the package body 23. In some embodiments, a single one of therespective backside surfaces 211 a, 211 b of the passive components 21a, 21 b is exposed from the package body 23. In other words, in someembodiments, a top surface 231 of the package body 23 is aligned (e.g.,substantially coplanar) with the backside surface 211 a or 211 b of oneor more of the passive components 21 a, 21 b. A lateral surface 232 ofthe package body 23 is aligned with the lateral surface 202 of thesubstrate 20; for example, the lateral surface 232 of the package body23 is substantially coplanar with the lateral surface 202 of thesubstrate 20. In some embodiments, the package body 23 includes an epoxyresin having fillers dispersed therein.

The package body 24 is disposed on a portion of the top surface 231 ofthe package body 23 and over the passive components 21 a, 21 b to coverthe passive components 21 a, 21 b. The package body 24 is not disposedover the active component 22. In some embodiments, a distance from a topsurface 241 of the package body 24 to the backside surface 211 a or 211b (e.g., top surfaces) of one or more of the passive components 21 a, 21b is in a range from about 50 μm to about 100 μm. A thickness of thepackage body 24 (e.g., a distance from the top surface 241 of thepackage body 24 to the top surface 231 of the package body 23) isdetermined according to a thickness difference between the activecomponent 22 and the passive components 21 a, 21 b. In some embodiments,an area of the package body 24 is greater than an area of each of thepassive components 21 a, 21 b. In some embodiments, the package body 24comprises, or is formed from, a photosensitive material, such as aphotopolymer resin. In some embodiments, the package body 24 and thepackage body 23 comprise a same material. Alternatively, the packagebody 24 and the package body 23 may comprise different materials. Insome embodiments, the top surface 241 of the package body 24 is higherthan the top surface 231 of the package body 24. For example, a firstdistance may be between the top surface 241 of the package body 24 andthe top surface 201 of the substrate 20, and a second distance may bebetween the top surface 231 of the package body 23 and the top surface201 of the substrate 20, and the first distance may be greater than thesecond distance.

The shielding layer 25 is disposed on external surfaces of the packagebody 23 and the package body 24 to cover the package body 23, thepackage body 24, the active component 22 and lateral surfaces 202 of thesubstrate 20. The shielding layer 25 is electrically connected to thegrounding element of the substrate 20. In some embodiments, theshielding layer 25 is a conformal shield. In some embodiments, athickness of the shielding layer 25 is substantially uniform. A bottomof the shielding layer 25 is aligned with a bottom surface 203 of thesubstrate 20; for example the bottom of the shielding layer 25 may besubstantially coplanar with a bottom surface 203 of the substrate 20. Insome embodiments, the shielding layer 25 is a conductive thin film, andmay include, for example, Al, Cu, Cr, Sn, Au, Ag, Ni or stainless steel,or a mixture, an alloy, or other combination thereof. The shieldinglayer 25 may include a single conductive layer or multiple conductivelayers. In some embodiments, the shielding layer 25 includes multipleconductive layers, and the multiple conductive layers may include a samematerial, or ones of the multiple conductive layers may includedifferent materials, or each of the multiple conductive layers mayinclude different materials from others of the multiple conductivelayers. In some embodiments, each conductive layer of the shieldinglayer 25 has a thickness of up to about 200 μm, such as up to about 150μm, up to about 100 μm, up to about 50 μm, up to about 10 μm, up toabout 5 μm, up to about 1 μm, or up to about 500 nm. In someembodiments, each conductive layer of the shielding layer 25 has athickness of down to about 100 nm or less, down to about 50 nm or less,or down to about 10 nm or less. In some embodiments, the shielding layer25 includes multiple conductive layers, and the different conductivelayers may have different thicknesses.

As stated above, since an additional package body (e.g., the packagebody 24) is disposed over the passive components 21 a, 21 b to increasethe mold clearance, the parasitic capacitance effect due to insufficientmold clearance may be reduced. Therefore, the accuracy of the passivecomponents 21 a, 21 b may increase and then insertion loss and returnloss of a filter formed by the passive components 21 a, 21 b may be wellcontrolled.

FIGS. 3A-3D illustrate a semiconductor manufacturing method inaccordance with some embodiments of the present disclosure.

Referring to FIG. 3A, a substrate strip including multiple substrates 30is provided, and the provision of the multiple substrates 30 allowsmultiple semiconductor package devices to be manufactured concurrently.The substrate 30 may be, for example, a printed circuit board, such as apaper-based copper foil laminate, a composite copper foil laminate, or apolymer-impregnated glass-fiber-based copper foil laminate. Thesubstrate 30 may include an interconnection structure, such as an RDL ora grounding element.

The passive components 31 a, 31 b are disposed on a top surface 301 ofthe substrate 30. The passive component 31 a, 31 b may be an electroniccomponent, such as a capacitor, a resistor or an inductor. Each passivecomponent 31 a, 31 bmay be electrically connected to one or more ofanother passive component 31 a, 31 b and to the substrate 30 (e.g., tothe RDL), and electrical connection may be attained by way of SMT.

The active component 32 is disposed on the top surface 301 of thesubstrate 30. The active component 32 may be an electronic component,such as an IC chip or a die. The active component 32 may be electricallyconnected to one or more of the passive electrical components 31 a, 31 band to the substrate 30 (e.g., to the RDL), and electrical connectionmay be attained by way of flip-chip or wire-bond techniques. In someembodiments, a height of the active component 32 measured from the topsurface 301 of the substrate 30 is greater than those of the passivecomponents 31 a, 31 b. Alternatively, the height of the active component32 may be less than that of at least one of the passive components 31 a,31 b. In some embodiments, the active component 32 is referred to as afirst electronic component and the passive component 31 a and/or 31 b isreferred to as a second electronic component.

A package body 33 is formed on the top surface 301 of the substrate 30and encapsulates a part of the top surface 301 of the substrate 30, thepassive components 31 a, 31 b and a part of the active component 32. Abackside surface 321 of the active component 32 is exposed from thepackage body 33. In other words, the backside surface 321 of the activecomponent 32 is aligned with a top surface 331 of the package body 33;for example, the backside surface 321 of the active component 32 issubstantially coplanar with the top surface 331 of the package body 33.A lateral surface 332 of the package body 33 is aligned with a lateralsurface 302 of the substrate 30; for example, the lateral surface 332 ofthe package body 33 is substantially coplanar with the lateral surface302 of the substrate 30. In some embodiments, the package body 33includes an epoxy resin having fillers dispersed therein. The packagebody 33 may be formed by a molding technique, such as transfer moldingor compression molding.

Referring to FIG. 3B, a package body 34 is formed on a portion of thetop surface 331 of the package body 33 and over the passive components31 a, 31 b. The package body 34 is not formed over the active component32. In some embodiments, the package body 34 can be formed by thefollowing operations: (i) coating a photosensitive material, such as aphotopolymer resin on the top surface 331 of the package body 33 andover the passive components 31 a, 31 b; and (ii) curing thephotosensitive material by ultra violet (UV) light. In operation (i),the coating can be accomplished by spraying. In some embodiments, adistance from a top surface 341 of the package body 34 to the backsidesurface 311 a or 311 b (e.g., top surfaces) of one or more of thepassive components 31 a, 31 b is in a range from about 50 μm to about100. A thickness of the package body 34 (e.g., a distance from the topsurface 341 of the package body 34 to the top surface 331 of the packagebody 33) is determined according to a thickness difference between theactive component 32 and the passive components 31 a, 31 b. In someembodiments, an area of the package body 34 is greater than an area ofeach of the passive components 31 a, 31 b. In some embodiments, thepackage body 34 and the package body 33 comprise a same material.Alternatively, the package body 34 and the package body 33 may comprisedifferent materials. In some embodiments, the top surface 341 of thepackage body 34 is higher than the top surface 331 of the package body33. For example, a first distance may be between the top surface 341 ofthe package body 34 and the top surface 301 of the substrate 30, and asecond distance may be between the top surface 331 of the package body33 and the top surface 301 of the substrate 30, and the first distancemay be greater than the second distance. In some embodiments, thepackage body 33 is referred to as a first package body 33 and thepackage body 34 is referred to as a second package body 34. In someembodiments, a package body includes a first portion 33 of the packagebody and a second portion 34 of the package body.

Referring to FIG. 3C, singulation may be performed to separate outindividual semiconductor package devices. That is, the singulation isperformed through the package body 33 and the substrate strip includingthe substrates 30. The singulation may be performed, for example, byusing a dicing saw, laser or other appropriate cutting technique.

Referring to FIG. 3D, a shielding layer 35 is formed to cover theexterior surface of the package body 33, the package body 34 and alateral surface 302 of the substrate 30. In some embodiments, theshielding layer 35 is a conformal shield. In some embodiments, athickness of the shielding layer 35 is substantially uniform. A bottomof the shielding layer 35 is aligned with a bottom surface 303 of thesubstrate 30; for example, the bottom of the shielding layer 35 issubstantially coplanar with the bottom surface 303 of the substrate 30.In some embodiments, the shielding layer 35 can be formed by sputteringor other appropriate technique. In some embodiments, the shielding layer35 is a conductive thin film, and may include, for example, Al, Cu, Cr,Sn, Au, Ag, Ni or stainless steel, or a mixture, an alloy, or othercombination thereof.

The shielding layer 35 may include a single conductive layer or multipleconductive layers. In some embodiments, the shielding layer 35 includesmultiple conductive layers, and the multiple conductive layers mayinclude a same material, or ones of the multiple conductive layers mayinclude different materials, or each of the multiple conductive layersmay include different materials from others of the multiple conductivelayers. In some embodiments, each conductive layer of the shieldinglayer 35 has a thickness of up to about 200 μm, such as up to about 150μm, up to about 100 μm, up to about 50 μm, up to about 10 μm, up toabout 5 μm, up to about 1 μm, or up to about 500 nm. In someembodiments, each conductive layer of the shielding layer 35 has athickness of down to about 100 nm or less, down to about 50 nm or less,or down to about 10 nm or less. In some embodiments, the shielding layer35 includes multiple conductive layers, and the different conductivelayers may have different thicknesses.

In the operation shown in FIG. 3B, the package body 34 is additionallyformed over the passive components 31 a, 31 b to increase the moldclearance, so the parasitic capacitance effect due to insufficient moldclearance may be reduced. Therefore, the accuracy of the passivecomponents 31 a, 31 b may increase and then insertion loss and returnloss of a filter formed by the passive components 31 a, 31 b may be wellcontrolled.

As used herein, the terms “substantially,” “substantial,”“approximately,” and “about” are used to denote and account for smallvariations. For example, when used in conjunction with a numericalvalue, the terms can refer to a range of variation of less than or equalto±10% of that numerical value, such as less than or equal to±5%, lessthan or equal to±4%, less than or equal to±3%, less than or equal to±2%,less than or equal to±1%, less than or equal to±0.5%, less than or equalto±0.1%, or less than or equal to±0.05%. As another example, a thicknessof a film or a layer being “substantially uniform” can refer to astandard deviation of less than or equal to±10% of an average thicknessof the film or the layer, such as less than or equal to±5%, less than orequal to±4%, less than or equal to±3%, less than or equal to±2%, lessthan or equal to±1%, less than or equal to±0.5%, less than or equalto±0.1%, or less than or equal to±0.05%. The term “substantiallycoplanar” can refer to two surfaces within μm of lying along a sameplane, such as within 40 μm, within 30 μm, within 20 μm, within 10 μm,or within 1 μm of lying along the same plane. Two surfaces or componentscan be deemed to be “substantially perpendicular” if an angletherebetween is, for example, 90°±10°, such as±5°, ±4°, ±3°, ±2°, ±1°,±0.5°, ±0.1°, or±0.05°. When used in conjunction with an event orcircumstance, the terms “substantially,” “substantial,” “approximately,”and “about” can refer to instances in which the event or circumstanceoccurs precisely, as well as instances in which the event orcircumstance occurs to a close approximation.

In the description of some embodiments, a component provided “on”another component can encompass cases where the former component isdirectly on (e.g., in physical contact with) the latter component, aswell as cases where one or more intervening components are locatedbetween the former component and the latter component.

Additionally, amounts, ratios, and other numerical values are sometimespresented herein in a range format. It can be understood that such rangeformats are used for convenience and brevity, and should be understoodflexibly to include not only numerical values explicitly specified aslimits of a range, but also all individual numerical values orsub-ranges encompassed within that range as if each numerical value andsub-range is explicitly specified.

While the present disclosure has been described and illustrated withreference to specific embodiments thereof, these descriptions andillustrations do not limit the present disclosure. It can be clearlyunderstood by those skilled in the art that various changes may be made,and equivalent elements may be substituted within the embodimentswithout departing from the true spirit and scope of the presentdisclosure as defined by the appended claims. The illustrations may notnecessarily be drawn to scale. There may be distinctions between theartistic renditions in the present disclosure and the actual apparatus,due to variables in manufacturing processes and such. There may be otherembodiments of the present disclosure which are not specificallyillustrated. The specification and drawings are to be regarded asillustrative rather than restrictive. Modifications may be made to adapta particular situation, material, composition of matter, method, orprocess to the objective, spirit and scope of the present disclosure.All such modifications are intended to be within the scope of the claimsappended hereto. While the methods disclosed herein have been describedwith reference to particular operations performed in a particular order,it can be understood that these operations may be combined, sub-divided,or re-ordered to form an equivalent method without departing from theteachings of the present disclosure. Therefore, unless specificallyindicated herein, the order and grouping of the operations are notlimitations of the present disclosure.

1. A semiconductor package device comprising: a substrate; a passivecomponent disposed on the substrate; an active component disposed on thesubstrate; and a package body disposed on the substrate, the packagebody comprising a first portion covering the active component and thepassive component, and a second portion covering the passive component,wherein a top surface of the second portion of the package body ishigher than a top surface of the first portion of the package body. 2.The semiconductor package device according to claim 1, furthercomprising a conductive layer disposed on the package body.
 3. Thesemiconductor package device according to claim 1, wherein the topsurface of the first portion of the package body is aligned with abackside surface of the active component.
 4. The semiconductor packagedevice according to claim 1, wherein the top surface of the firstportion of the package body is aligned with a backside surface of thepassive component.
 5. The semiconductor package device according toclaim 1, wherein the second portion of the package body comprises acured photosensitive material.
 6. The semiconductor package deviceaccording to claim 1, wherein an area of the second portion of thepackage body is larger than an area of the passive component.
 7. Thesemiconductor package device according to claim 1, wherein a distancefrom the top surface of the second portion of the package body to abackside surface of the passive component is in a range from about 50micrometers (μm) to about 100 μm. 8.-20. (canceled)
 21. Thesemiconductor package device of claim 2, wherein the conductive layer isconformal with the package body.
 22. The semiconductor package device ofclaim 2, wherein a backside surface of the active component contacts theconductive layer.
 23. The semiconductor package device of claim 1,wherein a portion of the passive component is exposed from the firstportion of the package body and is covered by the second portion of thepackage body.
 24. A semiconductor package device, comprising: asubstrate; a passive component disposed on the substrate; an activecomponent disposed on the substrate; a first package body disposed onthe substrate and covering at least a portion of the passive componentand the active component; and a second package body disposed on aportion of the first package body and over the passive component,wherein a distance between a top surface of the second package body anda top surface of the substrate is greater than a distance between a topsurface of the first package body and the top surface of the substrate.25. The semiconductor package device according to claim 24, furthercomprising a conductive layer disposed on the first package body and thesecond package body.
 26. The semiconductor package device according toclaim 24, wherein the conductive layer contacts a backside surface ofthe active component.
 27. The semiconductor package device according toclaim 24, wherein the top surface of the first package body is alignedwith a backside surface of the active component.
 28. The semiconductorpackage device according to claim 24, wherein the top surface of thefirst package body is aligned with a backside surface of the passivecomponent.
 29. The semiconductor package device according to claim 24,wherein a backside surface of the passive component is exposed from thefirst package body and is covered by the second package body.
 30. Thesemiconductor package device according to claim 24, wherein the firstpackage body and the second package body comprise a same material. 31.The semiconductor package device according to claim 24, wherein thefirst package body and the second package body comprise differentmaterials and the second package body comprises a photosensitivematerial.
 32. The semiconductor package device according to claim 31,wherein the second package body comprises a cured photosensitivematerial.
 33. The semiconductor package device according to claim 24,wherein a distance from the top surface of the second package body to abackside surface of the passive component is in a range from about 50 μmto about 100 μm.